{"id":1247,"date":"2021-03-23T17:03:12","date_gmt":"2021-03-23T21:03:12","guid":{"rendered":"https:\/\/demo.irdq.ca\/?post_type=project&#038;p=1247"},"modified":"2021-03-23T17:04:31","modified_gmt":"2021-03-23T21:04:31","slug":"encapsulation-technology-using-sic","status":"publish","type":"project","link":"https:\/\/demo.irdq.ca\/en\/project\/encapsulation-technology-using-sic\/","title":{"rendered":"ENCAPSULATION TECHNOLOGY USING SIC"},"content":{"rendered":"<h3>+EFFICIENT +INTEGRATED<\/h3>\n<p>Professor El-Gamal successfully demonstrated a thin-film encapsulation technology for above-IC MEMS wafer-level packaging. The uniqueness of this technology lies in its use of SiC as its main structural layer, and the fabrication process is fully CMOS compatible. Many MEMS devices require packaging either for protection only, or to improve performance. Thus, demand and interest in this type of wafer-level packaging is growing very fast in industry. In addition to significantly reducing the form factor of the final fully packaged device, fabrication yield is improved and cost is reduced.\u00a0 To demonstrate the feasibility of the technology, Pirani gauges were fabricated, packaged\/sealed, and shown to work as expected.<\/p>\n<h3>REFERENCES<\/h3>\n<p>[1] Paul-Vahe Cicek, Qing Zhang, Tanmoy Saha, Sareh Mahdavi, Karim Allidina, Frederic Nabki and Mourad El Gamal\u00a0<i>J. Micromech. Microeng.<\/i>\u00a0<b>23<\/b>\u00a0065013 (2013)<\/p>\n<h3>RESEARCHERS<\/h3>\n<p>Professor Mourad El-Gamal (McGill University), Professor Frederik Nabki (UQAM)<\/p>\n<h3>IRDQ CONTRIBUTION<\/h3>\n<ul>\n<li><a href=\"https:\/\/demo.irdq.ca\/en\/tag-product\/scanning-electron-microscopy-sem\/\">Scanning electron microscopy (SEM)<\/a><\/li>\n<li><a href=\"https:\/\/demo.irdq.ca\/en\/product-categories\/cleanroom\/optical-and-ebeam-lithography\/\">Optical and ebeam lithography<\/a><\/li>\n<li><a href=\"https:\/\/demo.irdq.ca\/en\/product-categories\/cleanroom\/etcher\/\">Etcher<\/a><\/li>\n<\/ul>\n","protected":false},"excerpt":{"rendered":"<p>+EFFICIENT +INTEGRATED Professor El-Gamal successfully demonstrated a thin-film encapsulation technology for above-IC MEMS wafer-level packaging. The uniqueness of this technology lies in its use of SiC as its main structural layer, and the fabrication process is fully CMOS compatible. Many MEMS devices require packaging either for protection only, or to improve performance. Thus, demand and [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":1250,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_et_pb_use_builder":"","_et_pb_old_content":"","_et_gb_content_width":""},"project_category":[650,657,654,651],"project_tag":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v23.5 - https:\/\/yoast.com\/wordpress\/plugins\/seo\/ -->\n<title>ENCAPSULATION TECHNOLOGY USING SIC | IRDQ<\/title>\n<meta name=\"robots\" content=\"noindex, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"ENCAPSULATION TECHNOLOGY USING SIC | IRDQ\" \/>\n<meta property=\"og:description\" content=\"+EFFICIENT +INTEGRATED Professor El-Gamal successfully demonstrated a thin-film encapsulation technology for above-IC MEMS wafer-level packaging. The uniqueness of this technology lies in its use of SiC as its main structural layer, and the fabrication process is fully CMOS compatible. Many MEMS devices require packaging either for protection only, or to improve performance. Thus, demand and [&hellip;]\" \/>\n<meta property=\"og:url\" content=\"https:\/\/demo.irdq.ca\/project\/technologie-dencapsulation-par-sic\/\" \/>\n<meta property=\"og:site_name\" content=\"IRDQ\" \/>\n<meta property=\"article:modified_time\" content=\"2021-03-23T21:04:31+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/demo.irdq.ca\/wp-content\/uploads\/2021\/02\/sic.elgamal_cwz-2.png\" \/>\n\t<meta property=\"og:image:width\" content=\"170\" \/>\n\t<meta property=\"og:image:height\" content=\"150\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/png\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"1 minute\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\/\/demo.irdq.ca\/project\/technologie-dencapsulation-par-sic\/\",\"url\":\"https:\/\/demo.irdq.ca\/project\/technologie-dencapsulation-par-sic\/\",\"name\":\"ENCAPSULATION TECHNOLOGY USING SIC | IRDQ\",\"isPartOf\":{\"@id\":\"https:\/\/demo.irdq.ca\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/demo.irdq.ca\/project\/technologie-dencapsulation-par-sic\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/demo.irdq.ca\/project\/technologie-dencapsulation-par-sic\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/demo.irdq.ca\/wp-content\/uploads\/2021\/02\/sic.elgamal_cwz-2.png\",\"datePublished\":\"2021-03-23T21:03:12+00:00\",\"dateModified\":\"2021-03-23T21:04:31+00:00\",\"breadcrumb\":{\"@id\":\"https:\/\/demo.irdq.ca\/project\/technologie-dencapsulation-par-sic\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/demo.irdq.ca\/project\/technologie-dencapsulation-par-sic\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/demo.irdq.ca\/project\/technologie-dencapsulation-par-sic\/#primaryimage\",\"url\":\"https:\/\/demo.irdq.ca\/wp-content\/uploads\/2021\/02\/sic.elgamal_cwz-2.png\",\"contentUrl\":\"https:\/\/demo.irdq.ca\/wp-content\/uploads\/2021\/02\/sic.elgamal_cwz-2.png\",\"width\":170,\"height\":150},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/demo.irdq.ca\/project\/technologie-dencapsulation-par-sic\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Accueil\",\"item\":\"https:\/\/demo.irdq.ca\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Projets\",\"item\":\"https:\/\/demo.irdq.ca\/project\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"ENCAPSULATION TECHNOLOGY USING SIC\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/demo.irdq.ca\/#website\",\"url\":\"https:\/\/demo.irdq.ca\/\",\"name\":\"IRDQ\",\"description\":\"Infrastructure en recherche et d\u00e9veloppement du Qu\u00e9bec\",\"publisher\":{\"@id\":\"https:\/\/demo.irdq.ca\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/demo.irdq.ca\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/demo.irdq.ca\/#organization\",\"name\":\"IRDQ\",\"url\":\"https:\/\/demo.irdq.ca\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/demo.irdq.ca\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/demo.irdq.ca\/wp-content\/uploads\/2021\/02\/irdq-logo-vertical.png\",\"contentUrl\":\"https:\/\/demo.irdq.ca\/wp-content\/uploads\/2021\/02\/irdq-logo-vertical.png\",\"width\":1705,\"height\":683,\"caption\":\"IRDQ\"},\"image\":{\"@id\":\"https:\/\/demo.irdq.ca\/#\/schema\/logo\/image\/\"}}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"ENCAPSULATION TECHNOLOGY USING SIC | IRDQ","robots":{"index":"noindex","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"og_locale":"en_US","og_type":"article","og_title":"ENCAPSULATION TECHNOLOGY USING SIC | IRDQ","og_description":"+EFFICIENT +INTEGRATED Professor El-Gamal successfully demonstrated a thin-film encapsulation technology for above-IC MEMS wafer-level packaging. The uniqueness of this technology lies in its use of SiC as its main structural layer, and the fabrication process is fully CMOS compatible. Many MEMS devices require packaging either for protection only, or to improve performance. 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