{"id":999,"date":"2021-02-23T11:08:13","date_gmt":"2021-02-23T16:08:13","guid":{"rendered":"https:\/\/demo.irdq.ca\/produit\/profilometry-xp-2\/"},"modified":"2021-04-13T16:06:55","modified_gmt":"2021-04-13T20:06:55","slug":"profilometry-xp-2","status":"publish","type":"product","link":"https:\/\/demo.irdq.ca\/en\/equipements\/profilometry-xp-2\/","title":{"rendered":"Profilometry (XP-2)"},"content":{"rendered":"

Additional information<\/h2>\n\n\n\n\n
MANUFACTURER<\/th>\nAmbios<\/td>\n<\/tr>\n
MODEL<\/th>\nXP-2<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

Analyses<\/h3>\n
    \n
  • Sampled depth: up to 50 nm<\/li>\n
  • Samples thickness: 30 mm max, vertical range: 400 \u00b5m max<\/li>\n
  • Vertical resolution: 1 \u00c5 to 10 \u00b5m, 15 \u00c5 to 100 \u00b5m<\/li>\n
  • Lateral resolution: 100 nm<\/li>\n<\/ul>\n

    Applications<\/h3>\n
      \n
    • Dimensional characterization (height, width) of etch or lithographic features<\/li>\n
    • Thin films stress measurement<\/li>\n
    • Surface roughness characterization<\/li>\n<\/ul>\n

      Characteristics<\/h3>\n
        \n
      • Motorized 150 mm x 178 mm stage<\/li>\n
      • Maximum length of a single scan: 60 mm; ability of digitally stitch scans up to 150 mm<\/li>\n
      • Stylus force: programmable from 0.5 mg to 10 mg<\/li>\n
      • Software for 3D rendering and stress measurement<\/li>\n
      • Scan data digitally stored<\/li>\n
      • Colour CCD camera with 40x to 160x motorized zoom<\/li>\n
      • Anti-vibration table (Herzan DT-6050MV)<\/li>\n
      • Removable 200 mm support for wafer stress measurement<\/li>\n
      • NIST certified step height standards of 1 \u00b5m and 100 nm<\/li>\n
      • 40 degree stylus of 2, 1 and 0.2 \u00b5m<\/li>\n<\/ul>\n","protected":false},"excerpt":{"rendered":"

        Additional information MANUFACTURER Ambios MODEL XP-2 Analyses Sampled depth: up to 50 nm Samples thickness: 30 mm max, vertical range: 400 \u00b5m max Vertical resolution: 1 \u00c5 to 10 \u00b5m, 15 \u00c5 to 100 \u00b5m Lateral resolution: 100 nm Applications Dimensional characterization (height, width) of etch or lithographic features Thin films stress measurement Surface roughness […]<\/p>\n","protected":false},"featured_media":979,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_et_pb_use_builder":"","_et_pb_old_content":"","_et_gb_content_width":""},"product_cat":[358,372],"product_tag":[623],"yoast_head":"\nProfilometry (XP-2) | IRDQ<\/title>\n<meta name=\"robots\" content=\"noindex, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Profilometry (XP-2) | IRDQ\" \/>\n<meta property=\"og:description\" content=\"Additional information MANUFACTURER Ambios MODEL XP-2 Analyses Sampled depth: up to 50 nm Samples thickness: 30 mm max, vertical range: 400 \u00b5m max Vertical resolution: 1 \u00c5 to 10 \u00b5m, 15 \u00c5 to 100 \u00b5m Lateral resolution: 100 nm Applications Dimensional characterization (height, width) of etch or lithographic features Thin films stress measurement Surface roughness […]\" \/>\n<meta property=\"og:url\" content=\"https:\/\/demo.irdq.ca\/equipements\/profilometre-xp-2\/\" \/>\n<meta property=\"og:site_name\" content=\"IRDQ\" \/>\n<meta property=\"article:modified_time\" content=\"2021-04-13T20:06:55+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/demo.irdq.ca\/wp-content\/uploads\/2021\/02\/icons-irdq-bg-1.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"600\" \/>\n\t<meta property=\"og:image:height\" content=\"600\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta 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