Wire Bonding
Wire Bonding
Additional information
| MANUFACTURER | Kulicke Soffa |
|---|---|
| MODEL | KS4523 |
Samples
- Surface covered: 134 mm x 134 mm
Characteristics
- Manual or semi-manual
- Soldering by ultrasonic (1.3 W or 2.5 W)
- Wire diameter:
- Gold from 13 µm to 76 µm
- Aluminum: from 20 µm to 76 µm
To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about the terms of use and availability, please complete the form below. After reviewing your request, we will get in touch with you promptly to offer the best available solution.