Polishing (1PM52-1)

Polishing (1PM52-1)

Additional information

MANUFACTURER Logitech
MODEL 1PM52-1

Samples

  • Sample size : up to 75 mm (3 in.)

Characteristics

  • Plate rotation speed : 70 rpm maximum
  • Frequency and amplitude controlled eccentric sweep
  • Polishing plate diameter : 30 cm
  • Application: Precision polishing of optical components
  • Materials: Silicon, Fused silicate (High purity grade), Barium BoroSilicate (BK7), Quartz and Aluminum

To use this equipment

The equipment available is accessible to the academic and industrial research community.

To learn about the terms of use and availability, please complete the form below. After reviewing your request, we will get in touch with you promptly to offer the best available solution.