Laser Photolithography

Laser Photolithography

Additional information

MANUFACTURER Heidelberg
MODEL DWL-66FS

Samples

  • Photomask size  : 152 mm (6 in.) maximum
  • Sample size : 152 mm maximum
  • Thickness : 10 mm maximum

Characteristics

  • Alignment precision: from 200 nm to 2000 nm (according to the resolution)
  • Laser diode, wavelength: 405 nm
  • Writing speed: from 1 mm²/min to 290 mm²/min (according to the resolution)

 

ROUTINE PROCESS

Photolithography

On negative resist

  • Minimum feature size : 2 µm
  • Thickness : from 1 µm to 3 µm

 

ROUTINE PROCESS

Photolithography

On positive resist

  • Minimum feature size : 1 µm
  • Thickness : from 1.5 µm to 7 µm

To use this equipment

The equipment available is accessible to the academic and industrial research community.

To learn about the terms of use and availability, please complete the form below. After reviewing your request, we will get in touch with you promptly to offer the best available solution.