Bonder
Bonder
Additional information
| MANUFACTURER | SUSS Microtec |
|---|---|
| MODEL | SB6E |
Samples
- Sample size: 25 mm to 150 mm (6 in.)
- Thickness: 2 mm minimum
Characteristics
- Temperature : ambient to 500 °C
- Pressure: atmospheric to 5×10-5 mBar
- Alignment precision : 1 µm
- Applied forces : 300 N to 20 kN
- From a mask aligner (equipment MA6 from Suss Microtec), the alignment is performed via an optical method (4 CCD cameras)
TYPES OF BONDING
- Fusion bonding, glass frit bonding, direct bonding, polymer adhesive,. metal eutectic bonding, anodic bonding, diffusion bonding
To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about the terms of use and availability, please complete the form below. After reviewing your request, we will get in touch with you promptly to offer the best available solution.