Aligner (200)
Aligner (200)
Additional information
| MANUFACTURER | OAI |
|---|---|
| MODEL | 200 |
Samples
- Photomasks sizes : 127 mm maximum
- Samples sizes : 10 mm to 100 mm
Characteristics
- Spectral selection : Near UV or far UV (wide spectrum)
ROUTINE PROCESS
Contact mode Photolithography
On : positive resists
- Minimum feature size : 1 µm
- Resist thickness : 0.5 µm to 2 µm
ROUTINE PROCESS
Contact mode Photolithography
On : negative resists
- Minimum feature size : 5 µm
- Resist thickness : 5 µm to 1000 µm
To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about the terms of use and availability, please complete the form below. After reviewing your request, we will get in touch with you promptly to offer the best available solution.