Wafer Saw (DAD3350)
Wafer Saw (DAD3350)
Additional information
| MANUFACTURER | Disco |
|---|---|
| MODEL | DAD3350 |
Samples
- Samples size : up to 200 mm (8 in.)
- Thickness: 10 mm maximum
- Cutting depth: 7 mm maximum
Characteristics
- Cutting area : 260 mm X 260 mm
- Vertical displacement range : 31 mm
- Positioning precision : 3 µm
- Lateral precision : 2 µm
- Vertical displacement precision : 0,05 µm
- Vertical repeatability : 1 µm
- Blade rotating speed : from 3 000 to 30 000 rpm
- Cutting speed : 600 mm/s with feedback control
- Angle of rotation : 360° with feedback control
Materials
- Glass
- Quartz
- Ceramics
- Silicon
- GaAs
To use this equipment
The equipment available is accessible to the academic and industrial research community.
To learn about the terms of use and availability, please complete the form below. After reviewing your request, we will get in touch with you promptly to offer the best available solution.